• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    composite piezoelectric body, composite piezoelectric element, and method for producing a composite piezoelectric body. there is a need for a composite piezoelectric body and a composite piezoelectric element utilizing a composite piezoelectric body that will not cause electrode defects, disconnection and peeling, even if the pizoelectric body is subjected to close-spaced processing. a composite piezoelectric body of the present invention includes a piezoelectric ceramic and an organic polymer material containing air bubbles mixed therein, wherein between the surfaces of the piezoelectric ceramic and the organic polymer material on which an electrode is to be formed is a layer of insulation on all or part of the surface of the organic polymer material on which the electrode is to be formed.
    公开号:BR112012015896B1
    申请号:R112012015896-1
    申请日:2010-10-25
    公开日:2021-06-01
    发明作者:Takayuki Ochi；Hiroki Kubota
    申请人:Tayca Corporation；
    IPC主号:
    专利说明:

    Field of Invention
    [0001] The present invention is related to a composite piezoelectric body and, in further details, is related to a composite piezoelectric body without causing defects, disconnection and stripping of the electrode, a method for producing the composite piezoelectric body and a composite piezoelectric element using the composite piezoelectric body. prior technique
    [0002] Several piezoelectric elements have been developed, in which the displacement applied from outside can be converted into electricity or, conversely, the applied electricity can be converted into displacement. Applicants for this application have also developed a piezoelectric element composed of a piezoelectric ceramic and an organic polymer material containing air bubbles mixed in it, as described in Patent Literature (PTL) 1.
    [0003] The composite piezoelectric element described in Patent Literature (PTL) 1 is produced through the processing steps illustrated in Fig. 2(b)
    [0004] That is, the composite piezoelectric element is produced first by performing the grooving procedure, to create a series of grooves in the ceramic, by machining; then, filling the grooves with a resin that evaporates at a predetermined temperature; then performing foam molding, to form the organic polymer material with air bubbles mixed in it, by finishing the resin treatment at a temperature at which the resin evaporates; then thickening processing is carried out to polish a composite material including ceramic and organic polymer material to a required thickness; then performing the electrode formation processing on the polished surface, ie the surface on which an electrode is to be formed, and finally performing the polarization processing.
    [0005] Therefore, the composite piezoelectric element described in Patent Literature (PTL) 1 includes organic polymer material containing air bubbles mixed in it and thus has the advantage that the acoustic impedance can be reduced as a coefficient of Electromechanical coupling, which indicates the performance of a piezoelectric element, is kept high.
    [0006] Furthermore, the composite piezoelectric body is normally expressed by the "number of XYZ directions in which piezoelectric ceramics can be exposed on end surfaces-the number of XYZ directions in which organic polymer material can be exposed on end surfaces" , such as type 1-3, type 2-2, type 0-3, type 3-0 or the like. Reference List PTL Patent Literature 1: Japanese Patent No. 4222467 Summary of the invention Technical problem
    [0007] The composite piezoelectric element described in Patent Literature (PTL) 1 is mainly used as transceiver probes, as an ultrasonic diagnostic equipment, an ultrasonic fault detector and the like. As described in paragraph [0037] of Patent Literature 1, the composite piezoelectric element has normally been used cut to a width of at least approximately 0.1 mm and thus does not cause any defect.
    [0008] Particularly, as described above, the composite piezoelectric element described in PTL 1 contains air bubbles mixed in the organic polymer material and thus when areas adjacent to the surfaces of the organic polymer material are polished during thickening processing, countersunk holes 5 can be generated due to air bubbles 4 existing near the surfaces of an organic polymer material 3 due to polishing, as illustrated in Fig. 5.
    [0009] However, even if countersunk holes are produced by the air bubbles 4 existing on the surfaces of the organic polymer material due to polishing, most of these holes are closed in the electrode formation processing step, thus causing virtually no defect during use. Furthermore, even in the state where countersunk holes are opened without being closed in a specified part of the electrode surfaces, that is, in the state where defects occur on the electrode surfaces, processing to achieve a customary cut width can create normal electrical continuity unless defects occur elsewhere, thus causing virtually no malfunction during use.
    [00010] However, in recent years, probes have been required to undergo narrow spacing processing with a cut width of 0.1 mm or less, and an attempt to perform such processing has rarely produced defects in the composite piezoelectric element described in PTL 1.
    [00011] That is, in the case of narrow spacing processing that has been required recently, due to the narrow width of a piezoelectric element after processing, the problem of rarely producing a piezoelectric element with several defective parts has been manifested, causing the problem of there is rarely any difficulty in achieving normal electrical continuity.
    [00012] The present invention was achieved due to the conventional problems described above, and the object of the present invention is to offer a composite piezoelectric body without causing defects, disconnection and stripping of the electrode, a method for producing the composite piezoelectric body and a composite piezoelectric element using composite piezoelectric body. Solution to problem
    [00013] To obtain the object, a composite piezoelectric body of the present invention includes a piezoelectric ceramic and an organic polymer material containing air bubbles mixed in it, in which between the surfaces of the piezoelectric ceramic and the organic polymer material in which a electrode must be formed, an insulating layer is formed on all or part of the surface of the organic polymer material on which the electrode is to be formed.
    [00014] Furthermore, the composite piezoelectric body of the present invention is characterized by an insulating layer thickness of 50 Dm or less.
    [00015] Also, the composite piezoelectric body of the present invention is characterized by an average bulk density of the organic polymer material and the insulating layer being 0.6 g/cm3 or less.
    [00016] In addition, the composite piezoelectric body of the present invention is characterized by an insulating layer that is composed of an epoxy resin.
    [00017] Also, a composite piezoelectric element of the present invention includes the composite piezoelectric body according to claims 1 to 4 and an electrode formed therein.
    [00018] In addition, a method for producing a composite piezoelectric body of the present invention goes through the steps of forming a series of grooves in a ceramic, by machining, filling the grooves with a resin that is evaporated at a predetermined temperature, formation of an organic polymer material containing air bubbles mixed in it by heat treatment at a temperature at which the resin is evaporated and forming an electrode, this method including a step of forming an insulating layer on all or part of a surface of the organic polymer material on which the electrode is to be formed.
    [00019] In addition, the method for producing a composite piezoelectric body of the present invention includes a non-electrical galvanizing step as the electrode formation step.
    [00020] In addition, the method for producing a composite piezoelectric body of the present invention is characterized by the non-electrical galvanizing step performed at 70°C or less.
    [00021] Each of the components of the present invention is described below.
    [00022] The material and type of piezoelectric ceramic used in the present invention are not particularly limited, as long as the displacement applied from outside can be converted to electricity or, conversely, the applied electricity can be converted to displacement.
    [00023] Examples of ceramics with these properties include barium titanate ceramics, lead titanate ceramics, lead zirconate titanate (PZT) ceramics, lead niobate ceramics, lithium niobate single crystals, niobate titanate single crystals lead zincate (PZNT), lead magnesite niobate titanate single crystals (PMNT), bismuth titanate ceramic, lead metaniobate ceramic and the like.
    [00024] The organic polymer material used in the present invention is not particularly limited, as long as it can be filled between columns of piezoelectric ceramic arranged to form the composite piezoelectric body and has the necessary insulation for the composite piezoelectric body.
    [00025] Examples of organic polymer material exhibiting these properties include solidified products of thermosetting resins, such as unsaturated polyester resins, allyl resins, epoxy resins, urethane resins, urea resins, melamine resins, phenol resins, and the like; and thermoplastic resins such as acrylonitrile copolymer resins, acrylonitrile-styrene copolymer resins, polyethylene resins, polypropylene resins, polystyrene resins, polyamide resins, polyoxymethylene resins, polycarbonate resins, polyethylene terephthalate resins, polybutylene terephthalate resins , PMMA resins and the like.
    [00026] When a thermoplastic resin is used for the organic polymer material, to prevent softening of the organic polymer material during the non-electrical galvanizing described below, a resin with a melting point or glazing temperature equal to or higher than the processing temperature of this processing step.
    [00027] In addition, the organic polymer material used in the present invention contains mixed air bubbles and has the effect that the vibration restriction of the piezoelectric ceramic can be reduced by air bubbles when the piezoelectric element vibrates by applying electricity to the element Composite piezoelectric and the acoustic impedance can be reduced while keeping the electromechanical coupling coefficient which indicates the performance of the composite piezoelectric element high.
    [00028] The method for mixing the air bubbles is not particularly limited, as long as the method creates a condition where the organic polymer material is filled with the air bubbles when the composite piezoelectric body is finally formed. The organic polymer material into which the air bubbles were previously mixed can be loaded or a resin mixed with a chemical that generates air bubbles which can be loaded and then heated to generate the air bubbles in the organic polymer material when the Organic polymer material is formed by solidification or curing.
    [00029] Furthermore, a method using a polymeric resin powder including a liquid described, for example, in Japanese Patent No. 4222467 can be applied. Specifically, in this method, the polymer resin powder of an acrylonitrile copolymer, which includes a liquid such as normal pentene, normal hexane, isobutane, isopentane or the like, and which is designed to evaporate the liquid when the polymer is softened by heating to a predetermined temperature, is previously inserted into the grooves of the piezoelectric ceramic, heated to a predetermined temperature to evaporate the enclosed liquid and soften the polymeric resin, and then cooled to solidify the polymeric resin and form the organic polymer material, including the evaporated gas as bubbles of air in the organic polymer material.
    [00030] The insulating layer of the present invention is not particularly limited, as long as the recessed holes existing in a surface of the organic polymer material are filled by thickening processing and as long as they do not contain any air bubbles. However, from the perspective of ease of processing and handling, the insulating layer is preferably formed using a resin material such as a thermosetting resin, a thermoplastic resin or the like.
    [00031] Furthermore, the composite piezoelectric body, other than the piezoelectric ceramic, is generally preferably made of an insulator to effectively transmit an electrical signal to the piezoelectric ceramic from the electrode. However, when good performance as an electromechanical coupling coefficient can be guaranteed in the formed composite piezoelectric body, the material is not necessarily limited to the insulating layer, and a conductive resin can also be used.
    [00032] When a thermoplastic resin is used for the insulating layer of the present invention, as in the organic polymer material, to prevent softening of the insulating layer during the non-electrical galvanizing described below, a resin with point temperature is preferably used melting or glazing equal to or greater than the processing temperature of this processing step.
    [00033] In addition, the insulating layer can preferably ensure adhesion to the electrode formed by the electrode formation processing.
    [00034] Before polishing by thickening processing, the insulation layer is formed by applying the resin to all or a portion of the surface of the organic polymer material on which an electrode is to be formed, and then curing the resin .
    [00035] The thickness of the insulating layer of the present invention is preferably 50 µm or less and more preferably 30 Dm or less, because, with an excessively wide thickness, the electromechanical coupling coefficient is reduced, and the acoustic impedance is increased.
    [00036] The average bulk density of the organic polymer material and the insulating layer of the present invention is preferably 0.6 g/cm3 or less and more preferably 0.5 g/cm3 or less, because, with an excessively high average bulk density, the vibration of ceramics in the composite piezoelectric element is restricted, the electromechanical coupling coefficient is reduced, and the acoustic impedance is increased.
    [00037] In the method for producing a composite piezoelectric body of the present invention, the processing step of the formation of the insulating layer must be performed before the electrode formation processing, because the insulating layer is adapted to prevent defects, disconnection and electrode stripping.
    [00038] To make it easy to adjust the thickness according to specifications, the processing step of forming the insulation layer is preferably carried out before the thickening processing step. 2(a), first, a processing to form an insulating layer is performed after the pre-polishing processing to generate countersunk holes in the surfaces of the organic polymer material; then thickening processing is carried out to polish the composite piezoelectric body to a thickness according to specifications.
    [00039] When a thickness according to specifications is guaranteed, even after processing to form the insulation layer, the processing step of forming the insulation layer can be performed after the thickening processing step.
    [00040] After thickening processing to polish the composite piezoelectric body to the required thickness, the electrode is formed on the polished surface, that is, the surface on which the electrode must be formed, thus generating a piezoelectric element composed of the present invention.
    [00041] In the method for producing a composite piezoelectric body of the present invention, a spray method, a vapor deposition method, or the like can be used in the processing step of electrode formation. However, non-electrical nickel plating or the like is preferred from the point of view of cost and electrode adhesion.
    [00042] Non-electrical galvanizing is preferably carried out at a temperature that does not cause expansion of the air bubbles, specifically at 70°C or less, because non-electrical galvanizing at an excessively high temperature causes expansion of the air bubbles formed in the processing of foam molding and thus re-generates projections and recesses on the surface of the organic polymer material, regardless of the polishing performed by thickening processing.
    [00043] After non-electrical galvanizing, if necessary, the electrode formation processing is performed by electrolytic gold galvanizing to form the composite piezoelectric element of the present invention. Advantageous Effects of the Invention
    [00044] According to the composite piezoelectric body and the composite piezoelectric element using the composite piezoelectric body of the present invention, the composite piezoelectric body includes the piezoelectric ceramic and organic polymer material containing air bubbles mixed in it, in which between the piezoelectric ceramic surfaces and the organic polymer material on which the electrode is to be formed, the insulating layer is formed on all or part of the surface of the organic polymer material on which the electrode is to be formed. Therefore, the composite piezoelectric body and the composite piezoelectric element can be produced without causing defects, disconnection and peeling of the electrode.
    [00045] In addition, the recessed holes produced by thickening processing in the surface on which the electrode is to be formed are filled with the insulating layer and thus the electrode can be bonded to the organic polymer material more strongly, further improving the power of the piezoelectric element, improving the handling ability in cutting processing and ensuring a more advantageous effect regarding the prevention of electrode disconnection during processing.
    [00046] In addition, as the composite piezoelectric body of the present invention is characterized by the thickness of the insulation layer being 50 Dm or less, it is possible to prevent defects, disconnection and stripping of the electrode, maintaining the high electromechanical coupling coefficient and reducing the acoustic impedance.
    [00047] In addition, as the composite piezoelectric body of the present invention is characterized by the average bulk density of the organic polymer material and the insulating layer being 0.6 g/cm3 or less, it is possible to prevent defects, disconnection and electrode peeling , keeping the electromechanical coupling coefficient high and reducing the acoustic impedance.
    [00048] In addition, as the composite piezoelectric body of the present invention is characterized by the insulating layer that is composed of an epoxy resin, it is possible not only to prevent defects and electrode disconnection, but also to more effectively prevent electrode peeling, and ensuring the effect of improving the potency of the composite piezoelectric element when the composite piezoelectric element is produced by further forming an electrode.
    [00049] In addition, according to the method for producing a composite piezoelectric body of the present invention, the method for producing a composite piezoelectric body goes through the step of forming a series of grooves in a ceramic, by machining, a step of filling the grooves with a resin that is evaporated at a predetermined temperature, a step of forming an organic polymer material containing air bubbles mixed in it by heat treatment at a temperature at which the resin is evaporated, and a step of forming an electrode, this method including a step of forming an insulating layer on all or part of a surface of the organic polymer material on which the electrode is to be formed. Therefore, a composite piezoelectric body can be produced without causing electrode defects, disconnection and peeling.
    [00050] In addition, the composite piezoelectric body of the present invention is characterized by the non-electrical galvanizing step performed as an electrode formation step and the non-electrical galvanizing step is performed at 70°C or less. Therefore, it is possible not only to suppress resin softening, but also to prevent the occurrence of projections and depressions on the surface of the organic polymer material that has been polished by thickening processing, thus producing a composite piezoelectric body without causing defects, disconnection and peeling of the electrode. Brief description of the drawings
    [00051] Fig. 1 is a schematic drawing illustrating a cross-section of a composite piezoelectric element of the present invention.
    [00052] Fig. 2 is a flowchart illustrating a method for producing a composite piezoelectric body and composite piezoelectric element of the present invention and a method for producing conventional elements and bodies.
    [00053] Fig. 3 is a schematic drawing illustrating the steps for producing a composite piezoelectric body and the composite piezoelectric element of the present invention.
    [00054] Fig. 4 is a drawing illustrating a continuity test method of a composite piezoelectric element of the present invention.
    [00055] Fig. 5 is a schematic drawing illustrating a cross-section of a conventional composite piezoelectric body. Best ways to put the invention into practice
    [00056] 1 is a schematic drawing illustrating a cross section of a composite piezoelectric element of the present invention. In a composite piezoelectric body 1 and a composite piezoelectric element 2 of the present invention, as shown in Fig. 1, the depression holes 5 produced from air bubbles 4 present near the surface of an organic polymer material 3 by polishing are filled with the insulating layer 7.
    [00057] Next, the composite piezoelectric body of the present invention is described in detail based on the examples and Figs. 2 and 3. The present invention is not limited to the examples below. Fig. 2 is a flow diagram showing a method for producing a composite piezoelectric body and a composite piezoelectric element of the present invention and a method for producing them in a conventional manner, and Fig. 3 is a schematic drawing showing the steps for producing a composite piezoelectric body and a composite piezoelectric element of the present invention.
    [00058] As illustrated in Fig. 2, Fig. 2(a) illustrating a production flow of the composite piezoelectric body of the present invention with the steps of pre-polishing processing and insulating layer formation processing that are not in Fig. 2(b) illustrating a conventional composite piezoelectric body production flow. (EXAMPLE 1)
    [00059] First, a mild lead zirconate titanate ceramic powder (manufactured by Tayca Corp.: L-155N, electromechanical coupling coefficient k33: 77%, relative dielectric constant 5700, Curie temperature: 155°C) was molded, degreased , and then fired at 1200°C to form a sintered ceramic body of lead zirconate titanate. The resulting lead zirconate titanate sintered ceramic body was processed with a surface grinder and a bilateral polishing machine to produce an 8a piezoelectric ceramic 60 mm long, 10 mm wide and 0.80 mm thick, illustrated in Fig. 3(a).
    [00060] Then slots 9 with a depth of 0.60 mm were formed with a blade with a width of 30 Dm of a cutting machine at a step of 100 Dm in parallel with one of the sides of the piezoelectric ceramic with rectangular plate shape 8a formed as described above, thus producing a piezoelectric ceramic 8b illustrated in Fig. 3(b), on which a series of 70 µm x 60 mm x 0.6 mm piezoelectric ceramic rectangular columns were arranged.
    [00061] Then grooves 9 formed in a pizoelectric ceramic 8b shown in Fig. 3(b) were filled with an acrylonitrile copolymer resin including normal hexane and pentane and then heat treated at 160°C for 5 minutes to produce a composite piezoelectric body 1a filled with an organic polymer material 3 including a solidified product of the acrylonitrile copolymer resin where the air bubbles 4 have been dispersed, as illustrated in Fig. 3(c).
    [00062] Then, as shown in Fig. 3(d), the excesses of the organic polymer material 3 and the piezoelectric ceramic 8b were removed by a bilateral polishing machine to adjust the thickness, producing a composite piezoelectric body 1b. In addition, undercut holes 5a were produced due to air bubbles 4 existing near the surfaces of the organic polymer material 3 during polishing, on the front and back surfaces of the composite piezoelectric body 1b.
    [00063] Then, as shown in Fig. 3(e), an epoxy resin (bulk density: 1.3 g/cm3) was applied to the front and back surfaces of the composite piezoelectric body 1b by a spatula method and cured by heating at 150°C for 60 minutes to form epoxy resin layers 6.
    [00064] Afterwards, excess resin 6 and piezoelectric ceramic 8b were removed with a bilateral polishing machine to adjust the thickness, producing a composite piezoelectric body 1 type 2-2 with a thickness of 0.35 mm, as shown in Fig. 3(f) in which the depression holes 5a formed in Fig. 3(d) were filled with insulating layers 7, where the size of each column of the columnar piezoelectric ceramic was 70 Dm □ 60 mm, and the volume ratio of columnar piezoelectric ceramics was 70%.
    [00065] Afterwards, for the purpose of forming electrodes in the resulting composite piezoelectric body 1, having a structure in which columns of 70 Dm □ 60 mm were arranged, the composite piezoelectric body 1 underwent non-electrical nickel plating 10 with a thickness of 0.5 at a temperature of 65°C of the galvanizing bath, and also electroplated with gold 11 with a thickness of 0.5 Dm. then, the electrodes formed on the four peripheral side surfaces and unnecessary parts of the periphery of the composite piezoelectric body 1 were cut with a cutting machine to produce a type 2-2 composite piezoelectric element with rectangular plate 2a shape of 45 mm □ 5 mm □ 0.35 mm shown in Fig. 3(g), in which the electrodes were formed on the surface of the composite piezoelectric body 1.
    [00066] Finally, the polarization treatment was carried out by applying a direct current voltage of 1 kV/mm at 60°C between both opposite electrodes of the type 2-2 composite piezoelectric element with rectangular plate 2a format, producing the piezoelectric element type 2-2 (2) planned composite, illustrated in Fig. 3(h).
    [00067] The geometric size of the resulting composite piezoelectric element 2 was measured with a micrometer and a Vernier gauge, and the thickness was measured with a precision balance to calculate the apparent density of the composite piezoelectric element 2. As a result, the apparent density was of 5.72 g/cm3.
    [00068] In addition, the calculated bulk density of the polymer component in the composite piezoelectric body 1 was 0.37 g/cm3. Measuring the thickness of the epoxy resin layer with a laser microscope found a thickness of 30 Dm. (EXAMPLE 2)
    [00069] A type 2-2 composite piezoelectric element including a piezoelectric ceramic at a volume ratio of 70% was produced using the same steps described in Example 1, except that, in Example 1, the thickness dimension was changed to 0, 45 mm. (EXAMPLE 3)
    [00070] A type 2-2 composite piezoelectric element including a piezoelectric ceramic at a volume ratio of 60% was produced using the same steps described in Example 1, except that the piezoelectric ceramic was formed in order to arrange a series of rectangular columns ceramic tile 45 µm □ 60 mm □ 0.6 mm. (EXAMPLE 4)
    [00071] A type 2-2 composite piezoelectric element including a piezoelectric ceramic at a volume ratio of 70% was produced using the same steps described in Example 1, except that, in Example 1, the thickness dimension was changed to 0, 14 mm. (EXAMPLES 5 TO 7)
    [00072] Type 2-2 composite piezoelectric elements including epoxy resin layers with different thicknesses, as described in Table 1, and each including a piezoelectric ceramic at a volume ratio of 70% were produced using the same steps described in Example 1 , except that, in Example 4, the heat treatment conditions were changed after filling with the acrylonitrile copolymer resin including normal hexane and pentane. (COMPARATIVE EXAMPLE 1)
    [00073] A piezoelectric ceramic in which a series of rectangular columns of piezoelectric ceramic 70 Dm □ 60 mm □ 0.6 mm was laid out, being produced using the same method described in Example 1, and the grooves formed in the piezoelectric ceramic were filled with an acrylonitrile copolymer resin including normal hexane and pentane and then heat treated at 160°C for 5 minutes to produce a piezoelectric body composed of an organic polymer material, including a solidified product of the acrylonitrile copolymer resin where the bubbles form air were dispersed.
    [00074] Afterwards, the excess resin and piezoelectric ceramic were removed with a bilateral polishing machine to adjust the thickness, producing a type 2-2 composite piezoelectric body with a thickness of 0.35 mm in which the size of each column of the ceramic Columnar piezoelectric was 70 Dm □ 60 mm, and the volume ratio of the columnar piezoelectric ceramic was 70%.
    [00075] Then, a type 2-2 composite piezoelectric element with rectangular plate shape 45 mm mm 5 mm □ 0.35 mm including piezoelectric ceramic at a volume ratio of 70% was produced using the same steps described in Example 1, except that the insulation layer is not inserted.
    [00076] Then, the electromechanical coupling coefficient (kt) was calculated in the thickness direction of each of the type 2-2 composite piezoelectric elements produced as described above in Examples 1 to 3 and Comparative Example 1. Specifically, the impedance characteristics The frequency values were measured with the 4294A impedance analyzer manufactured by Agilent Technologies Inc., and the calculation was made based on the resonance frequency (fr) and anti-resonance frequency (fa) resulting from longitudinal vibration (thickness vibration) according to Standard EM- 4501 JEITA (test methods for piezoelectric ceramic vibrators). Furthermore, the acoustic impedance was calculated from the resonant frequency (fr) and element thickness. The results are summarized in Table 1.
    [00077] The term "electromechanical coupling coefficient" refers to a coefficient that indicates the efficiency of the conversion of electrical energy applied to a piezoelectric element into mechanical energy or, conversely, the conversion of mechanical energy from vibration or the like into electrical energy, and indicates that the higher the coefficient, the greater the efficiency of converting electrical energy into mechanical energy and vice versa.
    [00078] Then, in each of the composite piezoelectric elements of type 2-2 of Examples 1 to 3 and Comparative Example 1, grooves were formed with a blade with a width of 30 Dm of a cutting machine at a pitch of 50 Dm in a direction along the end surfaces so that the depth of cut was 1/2 the thickness of the element, thus forming a matrix, dividing the element.
    [00079] Afterwards, a continuity test was performed on the matrix, using a tester to confirm the number of continuity defects in the matrix. (Continuity test)
    [00080] The continuity test was performed by welding a thin copper plate 12 to the upper end of the composite piezoelectric element 2, partially cutting the plate 12 and then placing an electrode 13 in contact with each of the lower end parts of the composite piezoelectric element 2 to test whether electrical continuity was guaranteed or not. The results are summarized in Table 1. [Table 1]

    [00081] The results presented in table 1 indicate that in each of the piezoelectric elements composed of Examples 1 to 3, the acoustic impedance can be reduced, while the electromechanical coupling coefficient is kept high and to suppress the occurrence of defects, disconnection and electrode stripping.
    [00082] On the other hand, in the piezoelectric element composed of Comparative Example 1, a faulty continuity is slightly observed and thus it is found that it is difficult to suppress the occurrence of defects, disconnection and stripping of the electrode during a narrow spaced processing.
    [00083] Furthermore, in any of the piezoelectric elements composed of Examples 1 to 7 and Comparative Example 1, the electromechanical coupling coefficient can be maintained at a high level of approximately 60% or more with low acoustic impedance and thus it is found that the composite piezoelectric element has a good performance. industrial applicability
    [00084] A composite piezoelectric body of the present invention can be used as a sensing material that converts an electrical signal into a displacement in an ultrasonic medical device, an aerial ultrasonic device, an underwater ultrasonic device, an ultrasonic solid state device and other devices ultrasonics, a sensing material that converts a displacement into an electrical signal in an acceleration sensor, etc. List of reference signals 1 composite piezoelectric body 2 a composite piezoelectric body 3 b composite piezoelectric body 4 composite piezoelectric element 2a composite piezoelectric element 5 organic polymer material 6 air bubbles 7 countersunk hole 5a countersunk hole 8 epoxy resin layer 9 epoxy layer insulation 8 piezoelectric ceramic 8a piezoelectric ceramic 8b piezoelectric ceramic 9 groove 10 non-electric galvanized layer 11 gold galvanized layer 12 copper plate 13 electrode
    权利要求:
    Claims (8)
    [0001]
    1. COMPOUND PIEZOELECTRIC BODY, comprising a piezoelectric ceramic and an organic polymer material (3) containing air bubbles (4) mixed in it, characterized by between the surfaces of the piezoelectric ceramic (8) and the organic polymer material that are in contact with an electrode, an insulating layer(7) is formed in depression holes formed on the surface of the organic polymer material that is in contact with the electrode(10).
    [0002]
    Composite piezoelectric body according to claim 1, characterized in that the thickness of the insulating layer (7) is 50 µm or less.
    [0003]
    3. Composite piezoelectric body, according to claims 1 or 2, characterized in that the average bulk density of the organic polymer material (3) and the insulating layer (7) is 0.6 g/cm3 or less.
    [0004]
    Composite piezoelectric body, according to any one of claims 1 to 3, characterized in that the insulating layer (70 is composed of an epoxy resin.
    [0005]
    5. COMPOUND PIEZOELECTRIC ELEMENT, characterized in that it includes a composite piezoelectric body (1), according to any one of claims 1 to 4, and an electrode formed therein.
    [0006]
    6. METHOD FOR PRODUCING A COMPOUND PIEZOELECTRIC BODY, characterized by including the steps of: forming a plurality of grooves(9) in a ceramic by machining; filling the grooves with a resin that evaporates at a predetermined temperature; forming an organic polymer material(3) containing air bubbles mixed in it by heat treatment at a temperature at which the resin evaporates; and formation of an electrode(10), in which the method also includes a step of, between surfaces of a pizoelectric ceramic and an organic polymer material that are in contact with the electrode, formation of an insulating layer(7) in holes of depression formed on the surface of the organic polymer material that is in contact with the electrode.
    [0007]
    7. Method according to claim 6, characterized in that it includes a non-electrical galvanizing step as the electrode formation step.
    [0008]
    8. Method according to claim 7, characterized in that the non-electrical galvanizing step is carried out at 70°C or less.
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    法律状态:
    2019-01-08| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2019-11-26| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-03-16| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2021-06-01| B16A| Patent or certificate of addition of invention granted|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 25/10/2010, OBSERVADAS AS CONDICOES LEGAIS. PATENTE CONCEDIDA CONFORME ADI 5.529/DF |
    优先权:
    申请号 | 申请日 | 专利标题
    JP2010-001278|2010-01-06|
    JP2010001278|2010-01-06|
    PCT/JP2010/068839|WO2011083611A1|2010-01-06|2010-10-25|Composite piezoelectric body, method for producing said composite piezoelectric body, and composite piezoelectric element using said composite piezoelectric body|
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